| 摘要 |
1,102,621. Soldering. ELECTROVERT MANUFACTURING CO. Ltd. 25 May, 1965 [7 April, 1965], No. 22113/65. Heading B3R. In soldering connections on a printed circuit board flux dissolved in a solvent is applied to the board, the fluxed board is subjected to radiant and forced convection heating to evaporate the solvent and molten solder is then applied to the board. An apparatus comprises a casing 16 containing at one end flux circulating means 17 having a wide elongated nozzle 21 for producing a standing flux wave and at the other end a solder heating and circulating means 18 having a wide elongated nozzle 26 for producing a standing wave of molten solder. Oil may be forcibly injected into the oil flow or applied as a film to the wave surface. Between the fluxing and soldering means are provided firstly a flat hot plate 60, to provide infra-red radiation, having elongated nozzles 61 through which hot dry air is blown upwardly and secondly in a smaller infra-red radiation, plate 65 not provided with air nozzles. Situated above the casing 16 are a pair of track rails 31 which are divided into sections 31A, 31B, 31C, Fig. 4, above the fluxing station, heating station and soldering station, respectively, and means are provided for adjusting the angle of tilt of each of the sections. One or more endless chains 33 having pusher elements are provided to move open rectangular carriers 35 for printed circuit boards along the rails. In operation printed circuit boards with components mounted thereon are carried by the carriers 35 through the fluxing wave which deposits liquid flux on the boards, then over the plate 60 where infra-red radiant heating and convection heating by hot dry air is provided, then through more intense infra-red radiant heating by the plate 65 and then through the wave of molten solder. The flux may be a rosin base flux dissolved in alcohol or a flux containing salts or organic acids dissolved in water. |
