| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the need for troublesome viscosity control of sealing resins, and to precisely form sealing resin materials for sealing a semiconductor chip without increasing the number of processes. SOLUTION: The semiconductor chip 10 is mounted on a circuit board 2, and also the semiconductor chip 10 is sealed by a sealing resin material 20. On the circuit board 2, there are formed an annular groove part 9 surrounding the mounting region 3 for the semiconductor chip 10; and a frame-shaped resin flow control part 6, which is formed by solder resist and silk printing, on which a solder resist layer 7 and insulation ink layer 8 are stacked, and which controls the flow of the sealing resin coated on the semiconductor chip 10 to mold the sealing resin material 20.</p> |
