| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip distinguishing method which correctly distinguishes a semiconductor chip so as to be bonded. SOLUTION: Different circuit patterns are formed on a monitoring chip related to the semiconductor chip. Positions of the circuit pattern and the semiconductor chip are related, the semiconductor chip is distinguished by the monitoring chip. An address is given to the semiconductor chip, data of non- defective and defective semiconductor chips are related to the monitoring chip. When the circuit pattern of the monitoring chip and a designated circuit pattern correspond, the semiconductor chip is taken as a product to be bonded. When the check result shows a non-correspondence between them, the distance from the existing position to the checked corresponding position is calculated and an x-axis and a y-axis of a moving table are controlled. Thereby, the moving table finally moves to an objective position (X, Y) where the semiconductor chip is positioned. Thus, only the objective semiconductor chip (non-defective semiconductor chip) is correctly distinguished to be picked up.
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