| 摘要 |
PROBLEM TO BE SOLVED: To simplify the work process by reducing the insulation layer having a surface to be flattened so that a chip can be vacuum-sucked at the time of packaging through packing and resulting bulk supply and to suppress variation of inductance under packaged state. SOLUTION: External electrodes 38 are provided at the opposite ends of a chip basic body 30, a coil 34 is formed of winding between both external electrodes and the coil ends are connected with the external electrodes. The chip basic body comprises an intermediate coil forming part 30a, and electrode forming parts 30b located at the opposite end parts thereof to project vertically from the coil forming part and integrated continuously to form the external shape. A conductor film is formed on the surface at both electrode forming parts to provide external electrodes, ends of the coil wound around the coil forming part are connected with the external electrodes on the side face thereof and insulation layers 36 are formed on the upper and lower surfaces of the coil forming part to cover the coil flatly. External shaft of the chip has maximum thickness and width of different dimensions and anisotropy in the longitudinal and lateral shapes.
|
