| 摘要 |
PURPOSE: A method for fabricating a bump is provided to form a bump of a desired height after a reflow process by using thick photoresist and stencil, and to improve height and uniformity by forming the bump through a two-step process after the reflow process. CONSTITUTION: A wafer(100) having a plurality of chips is prepared. A plurality of bonding pads(102) are formed on each chip. Each chip has a passivation layer(104) for protecting the chip and exposing the bonding pad. Under bump metals(UBM's) are formed on each bonding pad. Photoresist including a plurality of the first openings corresponding to the UBM's is formed on the wafer. Solder paste is filled in the first openings. The second openings correspond to the first openings by using a stencil having a plurality of the second openings on the photoresist. Solder paste is filled in the second openings. The stencil is removed. A reflow process is performed and the photoresist is eliminated. |
