| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-polishing method for accurately detecting a polishing end point, abnormal working and a dressed state. SOLUTION: In the polishing method of polishing a wafer W by pressing the wafer W on a polishing pad stuck on the upper surface of a rotated polishing surface plate with a prescribed pressure, while rotating it, polishing friction acting between the wafer W and the polishing pad is measured continuously, and the polishing end point is decided by detecting that the polishing friction changes by a preset change amount within preset unit time. |
