发明名称 Pressure control method
摘要 First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
申请公布号 US2002182878(A1) 申请公布日期 2002.12.05
申请号 US20020149678 申请日期 2002.06.13
申请人 HIROSE EIJI;IWABUCHI NORIYUKI;YOKOUCHI TAKESHI;SUZUKI SHINGO 发明人 HIROSE EIJI;IWABUCHI NORIYUKI;YOKOUCHI TAKESHI;SUZUKI SHINGO
分类号 H01L21/302;G05D16/00;H01J37/32;H01L21/00;H01L21/205;H01L21/3065;(IPC1-7):H01L21/302;H01L21/461 主分类号 H01L21/302
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