POWER SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION OF A POWER SEMICONDUCTOR MODULE

摘要

The invention relates to a power semiconductor module comprising active semiconductor components (5 to 10) placed on a carrier arrangement and a module housing (20) produced by plastic extrusion coating of the active semiconductor elements (5 to 10). In order to reduce or compensate for deformations arising as a result of mechanical stress during extrusion coating and plastic shrinkage, the carrier array consists of several carrier elements (1, 2, 3) that can be positioned independently of one another on different planes in the casting mold in such a way that a module housing (20) with a flat module bottom (25) is obtained.