| 发明名称 |
Method of and apparatus for chemical-mechanical polishing |
| 摘要 |
During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation thereof is used to minimize or eliminate the deleterious effects of the vibrations.
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| 申请公布号 |
US2002182978(A1) |
申请公布日期 |
2002.12.05 |
| 申请号 |
US20010871236 |
申请日期 |
2001.05.31 |
| 申请人 |
MOMENTUM TECHNICAL CONSULTING, INC. |
发明人 |
LUKNER RALF;HEHMEYER OWEN |
| 分类号 |
B24B37/04;B24B49/16;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/04 |
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