| 摘要 |
A flexible package fabrication method, which enables the IC chip packaging film and the inner lead automated bonding to be simultaneously done. The method includes the steps of preparing a base member, electroplating a circuit having inner leads, outer leads, test lines/test terminals on the base member, covering the top side of the circuit with a polyimide passivation film or layer of flexible solder protective paint, bonding the bumps of a bumped IC chip or passive element to the inner leads of the circuit by thermocompression bonding, removing the base member, and covering the bottom side of the circuit with a polyimide passivation layer or layer of flexible solder protective paint.
|
