| 发明名称 |
A RINSING SOLUTION AND RINSING AND DRYING METHODS FOR THE PREVENTION OF WATERMARK FORMATION ON A SURFACE |
| 摘要 |
The present invention is a novel rinsing solution and a novel rinsing method for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises water, an acid, and hydrogen gas. In an embodiment of the present invention the rinsing step would also comprise the filtering of ammonia (NH3) from the air around the cleaning station. In another embodiment of the present invention the rinsing step would be followed by a drying step that uses velocities of air exceeding 0.1 m/s. |
| 申请公布号 |
WO02054456(A3) |
申请公布日期 |
2002.12.05 |
| 申请号 |
WO2001US49804 |
申请日期 |
2001.12.21 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
VERHAVERBEKE, STEVEN;TRUMAN, J., KELLY |
| 分类号 |
B08B3/02;H01L21/00;H01L21/02;H01L21/306 |
主分类号 |
B08B3/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
