| 摘要 |
<p>A method of manufacturing a laminated wafer, comprising the steps of placing laminated wafers (27) and residual wafers (28), in stacked state, on susceptors (20) disposed in a heat treating furnace (10), moving a Bernoulli chuck (1) to a wafer holding position (60) on the susceptor (20) by driving an arm (56), sucking the laminated wafer (27) positioned on the upper side, moving the laminated wafer to a laminated wafer collecting table (50') for collection, sucking and holding the residual wafer (28), in the same manner, by the Bernoulli chuck (1) at the wafer holding position (60), and moving the residual wafer to a residual wafer collecting table (50') for collection, whereby, in the method of manufacturing the laminated wafer by so-called a smart cut method, the laminated wafer separated can be collected while suppressing the occurrence of defect, damage, and contamination, and an automization suitable for mass-production is enabled.</p> |
