| 摘要 |
<p>A photosensitive resin composition comprising a soluble polyimide, a compound having a carbon-carbon double bond and a photoreaction initiator and/or photosensitizer as main components; a photosensitive dry film resist using the composition; and a photosensitive dry film resist exhibiting excellent flame retardance. The resin composition affords a photosensitive dry film resist and a photosensitive cover ray film which exhibits good workability, can be developed with an alkaline solution, and satisfy the flame retardancy standard UL94V-0. Further, the film can be directly laminated without the use of an adhesive and is excellent in heat resistance, and thus can be suitably used as a photosensitive cover ray film for a printed board for use in electronic materials, a suspension for a hard disk, and the head portion of a hard disk in a personal computer.</p> |
