| 摘要 |
A flip chip package of monolithic microwave integrated circuit (MMIC) is disclosed. The MMIC includes a substrate having an top surface and a bottom surface; a MMIC chip, having an active surface and having the chip flipped over and covered on the substrate with the active surface as the contacting surface wherein a central area of the active surface has one or several active devices; a plurality of metal strips, provided in a periphery area of the active surface of the MMIC chip and electrically connected to the active device; a plurality of solder bumps implanted respectively on the metal strips on the active surface of the MMIC chip and electrically connected to the metal strips on the MMIC chip; a plurality of substrate's top surface metal strips, provided in a periphery area of the top surface of the substrate and electrically connected to the solder bumps; a plurality of substrate's bottom surface metal strips, provided in the periphery area of the bottom surface of the substrate; a plurality of via holes, penetrating through the substrate in the periphery area of the upper and bottom surfaces of the substrate and electrically connected to the metal strips on the upper and bottom surfaces of the substrate, and electrically connected to these metal strips thereof; as well as an underfill, filling all the chinks around the solder bumps and the plurality of the metal strips connected to the solder bumps on the substrate's surface, and covering up to a height that is slightly higher than the thickness of the MMIC chip. Moreover, the MMIC package for the high power application has a penetration hole through the substrate in the central area of the upper and bottom surfaces of the substrate and filled with a heat-dissipative material in order to obtain a package structure with optimum heat-dissipative effect.
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