发明名称 Printed wiring board and manufacturing method therefor
摘要 A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.
申请公布号 US2002182903(A1) 申请公布日期 2002.12.05
申请号 US20020195865 申请日期 2002.07.15
申请人 ISHIDA NAOTO;ASANO KOUJI 发明人 ISHIDA NAOTO;ASANO KOUJI
分类号 H05K1/11;H01L23/12;H01L23/498;H01R12/00;H05K1/14;H05K3/30;H05K3/34;H05K3/36;H05K3/46;(IPC1-7):H01R12/00 主分类号 H05K1/11
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