发明名称 |
PROCESS FOR PREPARING CU DAMASCENE INTERCONNECTION |
摘要 |
The present invention discloses a technique of enhancing adhesion between a passivation layer and a low-K dielectric layer, in which a SiO2 layer as the passivation formed on the low-K dielectric layer is subjected to N2O plasma annealing. This technique is useful in improving the yield of a process for preparing Cu damascene interconnection.
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申请公布号 |
US2002182851(A1) |
申请公布日期 |
2002.12.05 |
申请号 |
US20020107146 |
申请日期 |
2002.03.28 |
申请人 |
NATIONAL SCIENCE COUNCIL |
发明人 |
YEH CHING-FA;LEE YUEH-CHUAN;LIN CHIEN-HSING |
分类号 |
H01L21/768;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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