发明名称 |
Semiconductor device socket, assembly and methods |
摘要 |
A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.
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申请公布号 |
US2002182920(A1) |
申请公布日期 |
2002.12.05 |
申请号 |
US20020202539 |
申请日期 |
2002.07.23 |
申请人 |
FARNWORTH WARREN M.;KINSMAN LARRY D.;MODEN WALTER L. |
发明人 |
FARNWORTH WARREN M.;KINSMAN LARRY D.;MODEN WALTER L. |
分类号 |
H01R12/16;H05K7/10;(IPC1-7):H01R13/625 |
主分类号 |
H01R12/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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