| 摘要 |
An integrated optical cross-connect device and associated methods are described, the cross-connect device comprising a plurality M of input waveguides formed in a first material layer of an integrated circuit, a plurality N of output waveguides formed in a second material layer of the integrated circuit, and a plurality MN of micromechanically actuated bridge elements formed in at least one intermediate layer lying between the first and second material layers. Responsive to an electrical control signal, each bridge element establishes an index-guided, nonreflecting optical path between its associated input waveguide and its associated output waveguide. Preferably, the bridge element comprises an arcuate waveguide structure substantially surrounded by air or other nonsolid material, the arcuate waveguide structure being twistably connected to a remainder of the intermediate layer by a narrow neck portion. When electrostatically actuated, one end of the arcuate waveguide structure rises to meet the input waveguide while the other end lowers to meet the output waveguide. Associated fabrication methods and an expandable, modular cross-connect system based on the cross-connect device are also described.
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