发明名称 Securing heat sinks
摘要 A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.
申请公布号 US2002181204(A1) 申请公布日期 2002.12.05
申请号 US20010871587 申请日期 2001.05.31
申请人 SHIA DAVID;WONG THOMAS J. 发明人 SHIA DAVID;WONG THOMAS J.
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
代理机构 代理人
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