发明名称 |
Heat dissipation device having a load centering mechanism |
摘要 |
A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.
|
申请公布号 |
US2002180034(A1) |
申请公布日期 |
2002.12.05 |
申请号 |
US20010870952 |
申请日期 |
2001.05.30 |
申请人 |
WINKEL CASEY R.;ECKBLAD MICHAEL Z.;SOPKO JEFFREY J. |
发明人 |
WINKEL CASEY R.;ECKBLAD MICHAEL Z.;SOPKO JEFFREY J. |
分类号 |
H01L23/40;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|