| 摘要 |
A multi-layer wiring board comprises an insulating substrate having, on a central part of its top surface, a semiconductor device mounting portion and having, on its under surface, an external electrode. The insulating substrate includes a multilayered wiring having a first group of parallel wiring lines; a second group of parallel wiring lines arranged orthogonal thereto; and a group of through conductors for providing electrical connection therebetween. Power is supplied from the external electrode to the semiconductor device through built-in capacitors formed therewithin. The built-in capacitors are connected in parallel that have different resonance frequencies within a range from an operating frequency band for the semiconductor device to a frequency band for a harmonic component, and at an anti-resonance frequency occurring between the different resonance frequencies, a composite impedance is equal to or below a predetermined value.
|
