发明名称 Structures and methods to enhance copper metallization
摘要 Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a metallization layer. The insulator includes a polymer or an insulating oxide compound. And, the inhibiting layer has a compound formed from a reaction between the polymer or insulating oxide compound and a transition metal, a representative metal, or a metalloid.
申请公布号 US2002182858(A1) 申请公布日期 2002.12.05
申请号 US20020196078 申请日期 2002.07.16
申请人 MICRON TECHNOLOGY, INC. 发明人 FARRAR PAUL A.
分类号 H01L21/768;H01L23/532;(IPC1-7):H01L21/44 主分类号 H01L21/768
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