发明名称 |
Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method |
摘要 |
The spaces in chuck grooves 3a and 3b are evacuated to chuck the entire surface of a wafer 1 to the chuck surface of a wafer support table 3 and curve the wafer 1. A wafer 2 is horizontally opposed to the wafer 1, and the center of the wafer 2 is pressed by a press pin 6a. The centers of the two wafers 1 and 2 are contacted, and the contact portion gradually spreads to the vicinity of the periphery of a central portion 3c and takes a substantially circular shape. After that, the chuck by the chuck grooves 3a is stopped. Consequently, the wafer 1 flattens, and the entire surfaces of the wafers 1 and 2 are contacted.
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申请公布号 |
US2002182038(A1) |
申请公布日期 |
2002.12.05 |
申请号 |
US20020206214 |
申请日期 |
2002.07.29 |
申请人 |
TAKISAWA TORU;YONEHARA TAKAO;YAMAGATA KENJI |
发明人 |
TAKISAWA TORU;YONEHARA TAKAO;YAMAGATA KENJI |
分类号 |
H01L21/683;H01L21/00;H01L21/02;H01L21/20;H01L27/12;(IPC1-7):B65G1/00;B65G65/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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