| 摘要 |
<p>A smart label comprises a circuitry pattern (1) on a smart label substrate and a structural part (4) comprises an integrated circuit on a chip (5) on a structural part substrate. The structural part (4) is attached to the smart label substrate and/or the circuitry pattern (1). The circuitry pattern (1) is electrically connected to the integrated circuit on the chip (5) via at least one capacitor located outside the chip (5).</p> |
