| 发明名称 |
SOLID VIA LAYER TO LAYER INTERCONNECT |
| 摘要 |
The present invention relates to a method and structure for providing an interconnect between layers of a multilayer circuit board.
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| 申请公布号 |
US2002179334(A1) |
申请公布日期 |
2002.12.05 |
| 申请号 |
US20010867312 |
申请日期 |
2001.05.29 |
| 申请人 |
CURCIO BRIAN E.;FARQUHAR DONALD S.;MARKOVICH VOYA R.;PAPATHOMAS KONSTANTINOS I. |
发明人 |
CURCIO BRIAN E.;FARQUHAR DONALD S.;MARKOVICH VOYA R.;PAPATHOMAS KONSTANTINOS I. |
| 分类号 |
H05K3/32;H05K3/42;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
H05K3/32 |
| 代理机构 |
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