| 摘要 |
An improved signal buffer configuration has been developed for transmitting communication signals across line traces between ICs on a printed circuit board, printed wiring board, multi-chip module, integrated circuit carrier or package, or other interconnect substrate. For example, in some realizations, multiple ICs having mismatched input and output impedances are mounted on an printed circuit board and communicate with each other via line traces. A signal buffer IC is placed in-line with the connecting line trace. The buffer is sized to fit within the pitch spacing of the line trace and contains an input impedance control circuit and an output impedance control circuit. These impedance control circuits are adapted to receive a control signal to set the input and output impedances of the buffer to correspond to the impedances of the connecting line traces. In this manner, the impedances between the ICs connected by this line trace are effectively matched and transmission line errors between them are reduced.
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