发明名称 Substrate processing apparatus and a method for fabricating a semiconductor device by using same
摘要 A substrate processing apparatus includes a process tube, which processes a plurality of wafers held in a boat and a load lock chamber accommodating therein the boat before and after the boat is loaded into and unloaded from the process tube. The load lock chamber is raised and lowered along with the process tube disposed thereon by a boat elevator and a moving stroke of the load lock chamber is set to be greater than a length of the process tube.
申请公布号 US2002182870(A1) 申请公布日期 2002.12.05
申请号 US20020106375 申请日期 2002.03.27
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 MATSUNAGA TATSUHISA;SATO AKIHIRO;AKUTSU NORIO
分类号 C23C16/44;H01L21/22;H01L21/31;H01L21/677;H01L21/683;(IPC1-7):H01L21/311 主分类号 C23C16/44
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