| 摘要 |
A light- and heat-curing resin composition comprising (A) a resin compound which bears in the molecule both two or more (meth)acryloyl groups and a carboxyl group and has a weight-average molecular weight of 2,000 to 40,000 and an acid value of 50 to 250 mgKOH/g, (B) a compound which bears in the molecule both two or more (meth)acryloyl groups and a carboxyl group and has a weight-average molecular weight of 300 to 1,500, (C) a photo-radical polymerization initiator, and (D) an epoxy resin. This resin composition is useful as solder resist in the production of printed wiring boards, or suitable for the formation of insulating interlayers of printed wiring boards by a build-up process.
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