| 摘要 |
A method of manufacturing a laminated wafer,comprising the steps of placing laminated wafers(27)and residual wafers(28),in stacked state,on susceptors(20)disposed in a heat treating furnace(10),moving a Bernoulli chuck(1)to a wafer holding position(60)on the susceptor(20)by driving an arm(56),sucking the laminated wafer(27)positioned on the upper side,moving the laminated wafer to a laminated wafer collecting table(50')for collection,sucking and holding the residual wafer(28),in the same manner,by the Bernoulli chuck(1)at the wafer holding position(60),and moving the residual wafer to a residual wafer collecting table(50")for collection,whereby,in the method of manufacturing the laminated wafer by so−called a smart cut method,the laminated wafer separated can be collected while suppressing the occurrence of defect,damage,and contamination,and an automization suitable for mass−production is enabled.
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