| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an interior finishing resin is unpacked frequently in a resin mold device for a resin mold type electronic part in which a lead part is led out on approximately the same surface with the surface of the exterior finishing resin. SOLUTION: When a lower mold 11 including a lead frame 7 is covered with a cushioning film 13 by protruding the lead frame 7 slightly from the lower mold 11, a clearance S is formed in a part adjacent to the outer circumference of the lead frame 7. |
