发明名称 METHOD AND APPARATUS FOR MEASURING ADHESION OF THIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a measuring method and a measuring apparatus used for the method which are not limited by composition of a thin film, types of substrates and a mechanical vibration during measurement, etc., and can mea sure adhesion of the thin film having a thickness of the order of nanometers. SOLUTION: A base fixed to a support and having the thin film on a surface is placed in the vicinity of a scratching member attached to a lower face of a load adding mechanism. A loading member is mounted on an upper face of the load adding mechanism. The thin film and the scratching member are in a closely contacting state. The support or the load adding mechanism moves in the horizontal direction of the base. The thin film is scratched by the scratching member. The scratched surface of the thin film is analyzed. The adhesion of the thin film to the base is measured.</p>
申请公布号 JP2002350330(A) 申请公布日期 2002.12.04
申请号 JP20010160690 申请日期 2001.05.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKAO YUKIYASU;YOSHIDA YASUHIRO;KURATA TETSUYUKI;TAKAHASHI SADAJI;MAEDA MIKAKO;FUJII MASARU
分类号 G01N23/227;G01N13/00;G01N19/04;(IPC1-7):G01N19/04 主分类号 G01N23/227
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