| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor improved in temperature characteristics and environmental resistance. SOLUTION: This semiconductor pressure sensor is provided with sensor chip 5 and a package 1. In installation of the sensor chip 5 to the package 1, the back face of the sensor chip 5 is arranged substantially opposedly to the mounting face of the package 1, only the one side of the back face of the sensor chip 5 is stuck to the mounting face, and a clearance is formed between the sensor chip 5 back face excepting the adhesion part and the mounting face. The sensor chip 5 is arranged to the package 1 in the cantilever form, so that stress applied from the package 1 due to a temperature environmental change is hardly transmitted to the sensor chip 5, and consequently, the temperature characteristics and the environmental resistance can be improved. |
