| 摘要 |
PURPOSE: An anisotropic conductive film containing an organic sulfur compound coupling agent is provided, to prevent the weakening of the strength of an adhesive due to the absorption of moisture and to improve the affinity to metal particle besides an adhesive, thereby allowing the contact thickness between micro circuits to be maintained to be constant and enhancing the weather resistance and the reliability. CONSTITUTION: The anisotropic conductive film comprises a release film; and a conductive layer which is formed on the release film and is made of the composition of an insulating adhesive resin(1), a conductive particle and a coupling agent, wherein the coupling agent is an organic sulfur compound represented by the formula CnH(2n+1)SH(wherein n is an integer of 2-20). Preferably the content of the coupling agent is 1-20 parts by weight based on 100 parts by weight of the insulating adhesive resin; the insulating adhesive resin is at least one selected from the group consisting of a styrene-butadiene resin, a styrene resin, a modified epoxy resin, a urethane resin, a phenol resin, an amide-based resin, an acrylate-based resin, a polyimide resin and a polyetherimide resin; and the conductive particle is a metal-plated one comprising a core(2) selected from the group consisting of polystyrene, polymethacrylate, poly(methyl methacrylate), poly(vinyl acetate), their copolymer, and their cured one with a curing degree of 20-100%, and a plated metal layer(3) selected from the group consisting of Au, Ag, Fe, Cu, Ni, Ad, Bi, In, Al, Pd, Pt and Cr.
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