发明名称 RESIN MOLDING, METAL-COATED RESIN MOLDING, CIRCUIT BOARD, ILLUMINATION REFLECTING PLATE AND METHOD FOR MANUFACTURING RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a resin molding capable of obtaining a high adhesive property strength of a metal film via fine recesses. SOLUTION: Many fine recesses 1 are formed on a surface of the resin molding, and parts of contained fillers 2 are protruded into the recesses 1. When a metal film 4 is coated on the surface of the resin molding 3, the parts of the metal of the film 4 are intruded into the recesses 1 to enable an anchoring effect to be obtained. Further, the fillers protruded into the recesses 1 are intruded into the metal to increase the anchoring effect.
申请公布号 JP2002347089(A) 申请公布日期 2002.12.04
申请号 JP20010157632 申请日期 2001.05.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SATO MASAHIRO;IKEGAWA NAOTO
分类号 G02B5/10;B29C45/46;B29C45/77;B29C45/78;B29K105/16;B32B15/08;C08J5/00;C08J7/06;(IPC1-7):B29C45/46 主分类号 G02B5/10
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