发明名称 HEAD CHIP AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a head chip and its manufacturing method in which high- density printing is enabled by arranging chambers with high density even for a conductive ink, and corrosion and the like of electrodes is prevented. SOLUTION: In the head chip 11, chambers 17 which communicate with nozzle openings 25 are defined by side walls 19 to a substrate 16. The ink filled in the chambers 17 is discharged from nozzle openings 25 by impressing a driving voltage to electrodes 20 set to the side walls 19, thereby changing the volume in the chambers 17. The electrodes 20 are buried in the side walls 19.
申请公布号 JP2002347241(A) 申请公布日期 2002.12.04
申请号 JP20010155259 申请日期 2001.05.24
申请人 SII PRINTEK INC 发明人 KOSEKI OSAMU
分类号 B41J2/045;B41J2/055;B41J2/16;(IPC1-7):B41J2/045 主分类号 B41J2/045
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