| 摘要 |
PROBLEM TO BE SOLVED: To shorten a waiting time resulting from a substrate cooling process in vacuum, and to prevent a film peeling caused by thermal strain generating in the rapid cooling process. SOLUTION: The vacuum thin-film forming apparatus comprises arranging a dedicated cooling unit on the back side of a substrate, cooling the unit beforehand by supplying a cooling medium in the unit, contacting the cooling unit with the back side of the substrate simultaneously when starting formation of the thin film, and controlling the substrate temperature to 100 deg.C or lower. The apparatus, at this time, controls the substrate temperature within a temperature capable of taking out the substrate (100 deg.C or lower) with the use of a temperature sensor, while constantly circulating the cooling medium in the cooling unit, and consequently eliminates the waiting time in the cooling process, and also prevents the film peeling which occurs during the cooling process.
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