| 摘要 |
PROBLEM TO BE SOLVED: To form a thin film with uniform thickness, and to prevent production of a rejected article caused by dust, etc., adhered to a wafer surface. SOLUTION: A wafer 8 is adsorbed by a table 20 and held so as to face a target 4. The table 20 is driven by a motor of a driving means 18 through a shaft 30, and is rotated. Thereby, atoms 70 in the target material, even if they are unevenly emitted and scattered from the target 4, uniformly deposits on the whole surface of the wafer 8. As a result, a thin film of a target material with uniform film thickness is formed on the surface of the wafer 8. Also, the production of rejected articles can be prevented because dusts, etc., are shaken off from the wafer surface by the rotation of the wafer 8, even when they deposit on the surface of the wafer 8.
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