END-SEALING STRUCTURE AND END-SEALING METHOD OF PACKAGE NECK SECTION OF SEMICONDUCTOR LASER MODULE

摘要

PROBLEM TO BE SOLVED: To provide an end-sealing structure and end-sealing method for the package neck section of a semiconductor laser module which is capable of surely end-sealing the neck section without allowing solder melted by heating to drip or flow into the package. SOLUTION: A hot melt material arranging section 31 having a section larger than a connecting port 29 existing on the outer side of the connecting port 29 is formed in the neck section 27 forming the connecting port 29 to a housing section 4 and a slope 33 which inclines toward the connecting port 29 and is capable of supporting the annular hot melt material 35 is formed between the connecting port 29 and the hot melt material arranging section 31.