发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURE THEREOF
摘要 <p>In order to form an aluminum system wiring that does not peel off on an insulating film containing fluorine and to improve the reliability thereof, a semiconductor device according to the present invention includes an insulating film (14) containing fluorine formed on a substrate (11), a titanium aluminum alloy film (17a) formed on the insulating film (14) containing fluorine, and a metallic film (17b) comprising aluminum or an aluminum alloy formed on the titanium aluminum alloy film (17a). <IMAGE></p>
申请公布号 EP1262804(A1) 申请公布日期 2002.12.04
申请号 EP20010999842 申请日期 2001.12.05
申请人 SONY CORPORATION 发明人 ENOMOTO, YOSHIYUKI;KANAMURA, RYUICHI
分类号 H01L21/768;H01L23/52;H01L21/312;H01L21/316;H01L21/3205;H01L21/4763;H01L23/48;H01L23/522;H01L23/532;(IPC1-7):G02B5/30 主分类号 H01L21/768
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