| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method to solve the problems that a long time to absorb enough heat to seal a seal interface in a conventional method for sealing a cover tape made of a thermoplastic resin on a carrier tape by the heat of a sealing iron requires a long sealing time or the increased frequency of sealing, or can not carry out the sealing with a resin having a high-melting point, and can not be used for an electronic component weak against heat due to high calorific value, impurities therein cause a failure in sealing, and limited materials for the carrier tape or cover tape make the choice for the low manufacturing cost harder. SOLUTION: Ultrasonic waves are utilized as the sealing method and the shape of the iron is devised. |
