| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat transfer member, which will not deform in spite of having gone through various thermal histories, which permits miniaturization and which is interposed between a body to be heated or cooled, and a heat generating body or a heat absorbing body, which are superior in the heat transfer efficiency. SOLUTION: Bodies (13, 17) of plate-like heat transfer member (11, 16, 20), which are interposed between an object matter (W) to be heated or cooled and a heat generating part (14) or a heat-absorbing part (18), are formed of thin sheet materials, constituted of an Si crystal body having a very small linear expansion coefficient and a comparatively high thermal conductivity as well as thermal diffusivity. |
