| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of stripping a water soluble resist and a stripping liquid, by which the dissolution of solder is more excellently suppressed and the deposition of lead is prevented. SOLUTION: In the method of stripping the water soluble resist comprising forming a plating resist using the water soluble resist on a substrate on which copper foil is laminated, carrying out soldering and then stripping the water soluble resist, an organic compound N-tris(hydroxyl methyl)methyl glycine (another name is tricine) expressed by formula (1) or an organic compound or the salt expressed by formula (2) are contained in the stripping liquid. (In formula (1), N represents a tertiary amine bonded directly to -CH2 COOH group and each of R and R' is a substituent group or a molecular chain. In formula 2, N represents a tertiary amine bonded directly to -CH2 PO(OH)2 group and each of R and R' represents a substituent group or a molecular chain). |
