Process for automatic assembling of the upper and lower side of printed circuit boards with SMD components

摘要

An automatic assembly process is used for mounting electronic components on both sides of a printed circuit board and the system employs side by side transport conveyors, with one handling circuit boards (5) that receive components on one side followed by a second ass on the other to receive components on the other side. Components are transferred from feed tape (3) and onto the boards in a pick and place operation using a suction pipette (4). Components are initially bonded o the boards to ensure retention during handling following the deposition of solder paste. The boards are then subjected to reflow soldering to compete the process.