| 摘要 |
PROBLEM TO BE SOLVED: To obtain both a glass cloth substrate and prepreg capable of forming a glass/resin interface developing high heat resistance and mechanical strength as a glass cloth substrate and prepreg for a printed-circuit board requiring heat resistance and mechanical strength. SOLUTION: In this prepreg, a crosslinking density of a resin in the vicinity of a glass/resin interface is increased and a strong bond strength between glass and the resin is obtained by curing the resin in the vicinity of the glass/resin more quickly than the whole resin. Consequently the prepreg capable of forming the glass/resin interface developing high heat resistance and mechanical strength is obtained. |
