EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR THAT GIVES CURED PRODUCT RETAINING COLORLESS TRANSPARENCY

摘要

PROBLEM TO BE SOLVED: To provide a rapidly curable epoxy resin composition capable of giving a resin cured product capable of retaining colorless transparency without undergoing yellowing even when photo-irradiated. SOLUTION: The rapidly curable epoxy resin composition comprises a curable epoxy resin (A), an acid anhydride-based curing agent (B) having an action to cause the epoxy resin to cure, and a curing accelerator (C) comprising triphenylbenzyl phosphonium tetraphenylborate represented by formula (I). The resin cured product formed by curing the composition can retain colorless transparency even when irradiated with intense ultraviolet rays and is suitable for sealing an optical semiconductor element.