发明名称 VACUUM FILM-FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vacuum film-forming apparatus which does not reduce film-forming accuracy caused by distortion generated in a vacuum chamber, without making a structure of the vacuum chamber complicated and upsized. SOLUTION: The vacuum film-forming apparatus 30 comprises a vacuum chamber 1 of which the internal space is made to be vacuum atmosphere, a substrate rotating unit 2 for supporting a substrate 10, and a monitoring-light receiving part 11 and a light projecting part 12 for detecting film thickness formed on the substrate 10. The monitoring-light receiving part 11 and the monitoring-light projecting part 12 are fixed to standstill structures 18 and 17 on the outside of the vacuum chamber 1. The substrate-rotating unit 2 is fixed to both of the standstill structure 18 on the outside of the vacuum chamber 1, and the vacuum chamber 1 through a buffering means 21.
申请公布号 JP2002348657(A) 申请公布日期 2002.12.04
申请号 JP20020046237 申请日期 2002.02.22
申请人 SHIN MEIWA IND CO LTD 发明人 OKAMOTO KOICHI;FUKUDA YOSHICHIKA
分类号 B01J3/00;B01J19/00;C23C14/00;C23C14/30;C23C14/50;C23C14/54;H01L21/20;(IPC1-7):C23C14/00 主分类号 B01J3/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利