| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for readily peeling a bonded material having a sufficient adhesive strength without requiring warm water, a special apparatus or tool when the bonded material is to be peeled. SOLUTION: This method for peeling the bonded material comprises carrying out a treatment of an adhesive composition of the bonded material in which an adherend is joined with the adhesive composition composed of a cationic- polymerizable compound having >=1 cationic polymerization reactional groups of a structure represented by formula (1) (wherein, m and n are each 0, 1 or 2; and R1 , R2 , R3 and R4 are each methyl group, ethyl group, isopropyl group, isoamyl group, phenyl group or hydrogen atom) on the average based on one molecule and a structure represented by formula (2) and a photocationic polymerization initiator with water or a hydrophilic solvent and then peeling the adhesive composition from the adherend.
|
