| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin molding material excellent in flowability and reliability for a semiconductor device which is thin, multi-pin, long-wire or narrow pad-pitch or has semiconductor chips disposed on a packaging board, and to provide a semiconductor device sealed by the same, which is thin, multi-pin, long-wire or narrow pad-pitch or has semiconductor chips disposed on a packaging board, exhibiting decreased occurrence of molding defects such as voids or defects during reflow. SOLUTION: The sealing epoxy resin molding material comprises (A) an epoxy resin containing a sulfur atom, (B) a curing agent, and (C) a silane- coupling agent having a secondary amino group or (D) phosphate, as essential components, and the semiconductor device is sealed with the same. |
