发明名称 HEAD CHIP AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a head chip and its manufacturing method whereby low- voltage driving and high-density printing are enabled by thinning side walls where chambers are arranged with high density to drive, and forming a pattern is facilitated. SOLUTION: In the head chip 11, chambers 17 which communicate with nozzle openings 25 are defined by side walls 19 to one face of a substrate 16. The volume in the chamber 17 is changed by impressing a driving voltage to an electrode 20 set to the side wall 19, whereby ink filled inside the chamber is discharged from the nozzle opening 25. A dummy chamber 18 which opens to the other face of the substrate 16 is formed to the side wall 19 between the chambers 17. The dummy chamber 18 is formed in a depth to overlap with the chamber 17. Moreover, an electrode 20b is set to at least a region where the dummy chamber 18 overlaps with the chamber 17. The side wall is driven by the electrode 20b and an electrode 20a set in the chamber.
申请公布号 JP2002347239(A) 申请公布日期 2002.12.04
申请号 JP20010155257 申请日期 2001.05.24
申请人 SII PRINTEK INC 发明人 KOSEKI OSAMU
分类号 B41J2/045;B41J2/055;B41J2/16;(IPC1-7):B41J2/045 主分类号 B41J2/045
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