| 摘要 |
The present invention provides, in one aspect, a package (340) for reducing cross-talk between devices on a device substrate (330), an integrated device including the package (340), and a method of manufacture therefor. In one embodiment of the invention, the package (340) includes a cap (342) positioned over a first device (310). In such an embodiment, the cap (342) is configured to separate the first device (310) and a second device (320) and to substantially reduce cross-talk there between. The package (340) may further include a layer of barrier material (349) located on a surface of the cap (342). |
